Dominika Cibulkova vs. Su-Wei Hsieh, Wimbledon R4 Preview

🇬🇧 Wimbledon, R4 Preview
🇸🇰 Dominika Cibulkova vs. 🇹🇼 Su-Wei Hsieh

One of the most fascinating clashes on Manic Monday at Wimbledon sees Dominika Cibulkova come up against Taiwan’s Su-Wei Hsieh. Cibulkova and Hsieh have both defied the odds to reach the round of 16 at Wimbledon, the pair both beat a couple of seeded opponents on route to this stage and enter this fourth round clash full of confidence. Cibulkova heads into this match as the favourite but Hsieh is coming off a huge win over the world number 1 and will fancy her chances of an upset.

Dominika Cibulkova of Slovakia in action during her second round at the 2018 Wimbledon Championships Grand Slam tournament

Dominika Cibulkova has blasted her way through to the round of 16 without dropping a set. Cibulkova has beaten 3 quality opponents, victories over Alize Cornet, Johanna Konta and Elise Mertens have seen her through to the second week at Wimbledon for the third time in her career. Cibulkova was the unlucky player that was bumped from a seeded position when Serena Williams was granted the 25th seed, however, it is now turning out to be a blessing in disguise for the Slovakian who is relishing her underdog status.

Su-Wei Hsieh continues to her reach new heights in 2018. At the age of 32, Hsieh is into the second week at Wimbledon for the first time. Hsieh started her campaign with a 3 set victory over the 30th seeded Anastasia Pavlyuchenkova before comfortably beating Lara Arruabarrena in straight sets. Hsieh made her biggest move at third round stage where she saved match points to defeat world number 1: Simona Halep 3-6 6-4 7-5, the biggest win over Hsieh’s career thus far.

Cibulkova holds a perfect 2-0 record over Hsieh, both of those victories were in straight sets. The most recent match between the pair took place last year at the Australian Open, a tough 6-4 7-6 win for the Slovakian.

To view my analysis / prediction for this match: Click here

Leave a Reply

Your email address will not be published. Required fields are marked *